Description

Ultra-Flat 6″ Silicon Wafers

Ultra-Flat 6″ diameter Silicon Wafer for demanding substrate studies. The 6″ ultra-flat silicon wafer is shipped in a 6″ Wafer Carrier.

Also available as 5 x 5mm, 5 x 7mm, 10 x10mm stealth-diced dies in Gel-Pak® boxes. Stealth dicing eliminates edge-chipping and cutting debris associated with saw dicing, providing the cleanest, most uniform product possible.

All products are packed in class 10 clean room conditions.

Properties for 6″ (150mm) Ultra-Flat Wafer:

• Material: CZ Virgin Silicon Wafer
• Grade: Prime
• Diameter: 150mm
• Orientation: <100>
• Type/Dopant: P/Boron
• Resistivity: 10-20 ohm-cm
• Thickness: 675µm +/- 20µm
• TTV: ≤2µm
• Site Flatness: <=1µm
• Warp: ≤30µm
• Bow: ≤20µm
• Particles: ≤30@≥0.2µm
• Front Surface: Polished
• Back Surface: Etched
• Flat: 1 per SEMI Standard