Diamond Wire & Stainless Wire Blades
Wire saws are used for demanding applications where high precision, low damage, thin wafers, or thicker cross sections are cut. They are common for TEM sample preparation, single-crystal cutting, sectioning, wafering, and similar applications.

These blades are small loop wire blades, with a circumference of ~33″ +/- 0.125″ and are available in 0.015″ and 0.010″ wire thicknesses. Diamond wire is embedded with ~45 micron diamond abrasive, while Stainless Steel Blades are intended for use with abrasive slurry.

PELCO® Wire Loop Blades are compatible with the South Bay Technology, Inc. Model 850 and similar wire saws.