The typical range in thickness for dimpled samples is 100 microns to 760 microns. The sensor sensitivity range is at maximum 2mm, which has generally limited operation to a small range of sample thickness. This kit provides a set of shims and a larger diameter tool that allows both taller and wider samples to be dimple polished. It greatly extends the utility for delayering larger semiconductor samples, and for other selective area polishing applications. The kit extends the maximum sample size to ~0.5″ (12mm) in height and up to 3″ (75mm) in diameter. It can be used with any of the PELCO® Dimpler™ tool or platen sets, and is fully backwards compatible with all PELCO® and South Bay Technology D500i Dimplers.