EPO-TEK H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
It is an excellent heat-sinking adhesive and is recommended for thermal management applications where good heat dissipation is needed.EPO-TEK H70E exhibits excellent handling characteristics and an extremely long pot life at room temperature.
Easy to use; can be screen printed, machine dispensed, stamped or hand applied.Excellent adhesion to ferrous and non-ferrous metals, glass, ceramic, kovar and PCB.
Can be cured very rapidly.
| Cure Schedule (minimum bond temperature/time) | |
|---|---|
| 175 °C | 1 Minute |
| 150 °C | 5 Minutes |
| 120 °C | 15 Minutes |
| 80 °C | 90 Minutes |
Properties (summary)
 | Download Technical Note |
| Download Guide to working with Epoxies |
| Download Reworking Cured Epoxy |
| Art. | Description | Unit | Price | Quantity | |
|---|---|---|---|---|---|
| 16017 | EPO-TEK H70E Epoxy | 85g | € 170,20 |