Colloidal Silica Suspension

A non-crystallizing silica (SiO2) suspension stabilized at an alkaline pH value of 9.8.
The combination of very fine abrasive particles in a chemically aggressive liquid provides a Chemical-Mechanical Polishing (CMP) action.

Ideal for final polishing to obtain a deformation-free surface. Obtain excellent results on IC-cross sections, ceramics, minerals, hard steels and ductile non-ferrous materials.
Recommended as final polishing for EBSD samples.

Supplied in 32 oz bottle (950ml) with a 40% particle concentration in water, pH range 9.7-9.9.