Handheld tools for cutting and cleaving glass, silicon, and hard materials.
Carbide wheels produce fewer particles when scribing, when compared to diamond pointed scribes.

Both large and small CleanBreak pliers are included for handling larger and thicker samples.
The cutters included are: Standard cutter for general purposes cutting of glass, silicon, and other crystalline materials. Also suitable for thin glass 0.3-1.5 mm and hard glass 0.3-6mm thick; Laser cutter, allowing higher surface penetration and non-slip start.

It is used for glass 0.1-2 mm think, hard glass 0.3-2 mm thick, and quartz, silicon, and III-V substrates; Cutter for ultra-thin glass 0.03-2mm and hard glass 0.3-2mm.

It also excels at cutting thin quartz and III-V substrates.