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Single Diamond Wire Blades
Diamond Wire & Stainless Wire Blades
Art.
812-850-010D

Description

Diamond Wire & Stainless Wire Blades
Wire saws are used for demanding applications where high precision, low damage, thin wafers, or thicker cross sections are cut. They are common for TEM sample preparation, single-crystal cutting, sectioning, wafering, and similar applications.

These blades are small loop wire blades, with a circumference of ~33″ +/- 0.125″ and are available in 0.015″ and 0.010″ wire thicknesses. Diamond wire is embedded with ~45 micron diamond abrasive, while Stainless Steel Blades are intended for use with abrasive slurry.

PELCO® Wire Loop Blades are compatible with the South Bay Technology, Inc. Model 850 and similar wire saws.

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Description
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Diamond Wafering Blade, 3″ x 0.015″ x 1/2″ hole
Art.
no. 812-310 to 812-317-5

Description

Diamond Sectioning / Wafering Blades

Can be used on all popular precision sectioning and cutting saws from PELCO, Buehler, LECO, Struers, Allied and many others.

These competitively priced Smart Cut precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life.
The man-made diamond crystals in the Smart Cut diamond sectioning blades / wafering blades are oriented in such a way that diamonds are only activated at the exposed layer.

As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.

The advantages are:

• Faster cutting action leaves smooth finish
• Less glazing requires minimal dressing
• More universal compatible with a greater variety of materials

All Smart Cut diamond blades have a metal bonded diamond height of 4mm and are available in 3, 4, 5 & 6″ diameter with the industry standard 1/2″ or 5/8″ holes.
Three grades are offered to fit most applications:

LC200MF medium/fine grit low concentration for hard and tough materials, hard coating, hard ceramics and concrete ( equivalent to Buehler 15LC)
HC150MC medium/coarse grit – high concentration for composite materials, PCB, soft metals and bone (equivalent to Buehler 15HC)
HC320F fine grit high concentration for glass fiber and carbon composites, soft ceramics and optical materials (equivalent to Buehler 5LC and 10LC)

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Description
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PELCO Diamond Wafering Blade, 3 x 0.006 x 1/2″ hole
Art.
no. 812-328 to 812-360

Description

PELCO High Quality Diamond & cBN Wafering Blades for all 1/2″ Arbor Precision Cut-Off Saws

Can be used on all popular precision sectioning and cutting saws from PELCO, Buehler, LECO, Struers, Allied and many others.

These competitively priced Smart Cut precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life.
The man-made diamond crystals in the Smart Cut diamond sectioning blades / wafering blades are oriented in such a way that diamonds are only activated at the exposed layer.

As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.

The advantages are:

• Faster cutting action leaves smooth finish
• Less glazing requires minimal dressing
• More universal compatible with a greater variety of materials

All Smart Cut diamond blades have a metal bonded diamond height of 4mm and are available in 3, 4, 5 & 6″ diameter with the industry standard 1/2″ or 5/8″ holes.
Three grades are offered to fit most applications:

LC200MF medium/fine grit low concentration for hard and tough materials, hard coating, hard ceramics and concrete ( equivalent to Buehler 15LC)
HC150MC medium/coarse grit – high concentration for composite materials, PCB, soft metals and bone (equivalent to Buehler 15HC)
HC320F fine grit high concentration for glass fiber and carbon composites, soft ceramics and optical materials (equivalent to Buehler 5LC and 10LC)

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Product
Description
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Product

PELCO High Quality Abrasive Blades for all 1/2″ Arbor Precision Cut-Off Saws
Art.
no. 812-361 to 812-363

Description

PELCO High Quality Abrasive Blades for all 1/2″ Arbor Precision Cut-Off Saws

Can be used on all popular precision sectioning and cutting saws from PELCO, Buehler, LECO, Struers, Allied and many others.

These competitively priced Smart Cut precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life.
The man-made diamond crystals in the Smart Cut diamond sectioning blades / wafering blades are oriented in such a way that diamonds are only activated at the exposed layer.

As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.

The advantages are:

• Faster cutting action leaves smooth finish
• Less glazing requires minimal dressing
• More universal compatible with a greater variety of materials

All Smart Cut diamond blades have a metal bonded diamond height of 4mm and are available in 3, 4, 5 & 6″ diameter with the industry standard 1/2″ or 5/8″ holes.
Three grades are offered to fit most applications:

LC200MF medium/fine grit low concentration for hard and tough materials, hard coating, hard ceramics and concrete ( equivalent to Buehler 15LC)
HC150MC medium/coarse grit – high concentration for composite materials, PCB, soft metals and bone (equivalent to Buehler 15HC)
HC320F fine grit high concentration for glass fiber and carbon composites, soft ceramics and optical materials (equivalent to Buehler 5LC and 10LC)

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