Description
Silver Conductive Epoxy, H-22 EPO-TEK
Two component, silver-filled epoxy system, consisting of a silver resin paste and a liquid hardener (100:4.5).
It is a free flowing paste, 100% solids system characterized by outstanding high temperature properties as well as excellent solvent, chemical and moisture resistance.
It has a long pot life and is fast curing at relatively low temperatures.
Containing no solvents or thinners; it will not outgas.
It can be applied by brush, spatula or hypodermic needle. H-22 can be useful for small angle cleavage in material science and semi-conductor applications.
EPO-TEK silver content is 60% by weight of composition.
NASA approved passes NASA low outgassing standard ASTM E595 with proper cure.
Note: Mixing ratio for this product is 100 parts silver resin paste to 4.5 parts liquid hardener.
| Properties | Cure Schedule (minimum bond temperature/time) | |||
|---|---|---|---|---|
| Color | silver | 150 °C | 5 minutes | |
| Consistency | smooth, flowing paste | 120 °C | 10 minutes | |
| Sheet resistance | 2 ohms/sq/mil | 100 °C | 20 minutes | |
| Refrigeration | not required | 80 °C | 45 minutes | |
| Viscosity | High (20,000cps) | |||
