Description
EPO-TEK H70E is a two component, thermally conductive, electrically insulating epoxy designed for chip bonding in microelectronic and optoelectronics applications.
It is an excellent heat-sinking adhesive and is recommended for thermal management applications where good heat dissipation is needed.EPO-TEK H70E exhibits excellent handling characteristics and an extremely long pot life at room temperature.
Easy to use; can be screen printed, machine dispensed, stamped or hand applied.Excellent adhesion to ferrous and non-ferrous metals, glass, ceramic, kovar and PCB.
Can be cured very rapidly.
| Cure Schedule (minimum bond temperature/time) |
|
|---|---|
| 175 °C | 1 Minute |
| 150 °C | 5 Minutes |
| 120 °C | 15 Minutes |
| 80 °C | 90 Minutes |
Properties (summary)
- Color : Grey / Beige
- Consistency: Slightly Pourable Paste
- Viscosity: 4,000 7,000 cps
- Thermal Conductivity: 0.9 W/mK
- Operating Temperature: -55 C to 200 °C (-67 to 392 °F)
- Pot Life: 56 hours
