Description
Ultra-Flat 6″ Silicon Wafers
Ultra-Flat 6″ diameter Silicon Wafer for demanding substrate studies. The 6″ ultra-flat silicon wafer is shipped in a 6″ Wafer Carrier.
Also available as 5 x 5mm, 5 x 7mm, 10 x10mm stealth-diced dies in Gel-Pak® boxes. Stealth dicing eliminates edge-chipping and cutting debris associated with saw dicing, providing the cleanest, most uniform product possible.
All products are packed in class 10 clean room conditions.
Properties for 6″ (150mm) Ultra-Flat Wafer:
- Material: CZ Virgin Silicon Wafer
- Grade: Prime
- Diameter: 150mm
- Orientation: <100>
- Type/Dopant: P/Boron
- Resistivity: 10-20 ohm-cm
- Thickness: 675µm +/- 20µm
- TTV: ≤2µm
- Site Flatness: <=1µm
- Warp: ≤30µm
- Bow: ≤20µm
- Particles: ≤30@≥0.2µm
- Front Surface: Polished
- Back Surface: Etched
- Flat: 1 per SEMI Standard
