Description
Silver Conductive Epoxy, H2OE EPO-TEK
Two component, silver filled, epoxy system consisting of a silver resin paste and a silver resin hardener (1:1).
It is a smooth, thixotropic paste, 100% solids system characterized by outstanding high temperature properties and excellent solvent, chemical and moisture resistance.
It has a long pot life and is fast curing at relatively low temperatures.
Will withstand 200 °C for 1,000 hours.
Containing no solvents or thinners, it will not outgas. H20E is ideal for electronic applications.
Cures rapidly. Easy to use; the pure silver powder is dispersed in both the resin and the hardener so that it can be used in a convenient 1:1 mixing ratio.
Non-toxic complies with USP Class VI Biocompatibility standards.
NASA approved passes NASA low outgassing standard ASTM E595 with proper cure. Ref: http://outgassing.nasa.gov.
Refrigerationnot required
| Properties | Cure Schedule (minimum bond temperature/time) | |||
|---|---|---|---|---|
| Color | bright silver | 175 °C | 45 seconds | |
| Consistency | smooth, thixotropic paste | 150 °C | 5 minutes | |
| Sheet resistance | 0,16 ohms/sq/mil | 120 °C | 20 minutes | |
| Continuous Operating temperature | 200 °C | 100 °C | 2 hours | |
| Degradation Temperature | 410 °C | 80 °C | 3 hours | |
| Viscosity | Low (2000cps) | |||
